On Aug. 18, the Korea Basic Science Institute (KBSI) announced that it transferred a technology to the Hanmac Corporation that can identify the defects of next-gen semiconductor chips in three dimensions. The new technology was developed by one of its research teams headed by Dr. Kim Gun-hee. The company is a local small and mid-sized company specializing in manufacturing electrical and electronic measurement equipment.
The agreed amount for the transfer of technology is 100 million won (US$84,264) for fixed royalties and 3 percent of sales in running royalties, and the transfer is expected to help the company increase sales by as much as billions of won.
The transferred tech can pinpoint the location of defects occurring in stacked semiconductor chips twice as fast as existing methods, using heat images. It can also detect malfunctioning spots stemming from low current, which mainly occur in advanced semiconductor chips.
The Hanmac Corporation is planning to make a prototype of the defect-identifying device and conduct product testing in partnership with the KBSI, and to supply those products to local semiconductor companies.